... converter topologies (Buck/Buck-Boost), ESL modeling, and EMI/EMC mitigation. - Experience with OSFP mechanical constraints, flex-rigid PCBs, and multi-die integration (e.g., co-packaged optics). - Preferred Skills - Familiarity with thermal co-simulation (e.g., Ansys Icepak integration) for heat-affected PDN performance. ...
Bengaluru, भारत