Renesas Electronics
Senior Principal Engineer, Silicon Photonics Architect
- Remote
- Hybrid
- Full-time
- Contract
... data-center interconnect AI/HPC fabrics or high-speed Ethernet applications Advanced packaging such as 2.5D/3D integration interposers hybrid bonding flip-chip fiber attach laser integration thermal solutions and package-level optical/electrical co-design Additional Information : Renesas is an embedded semiconductor solution ...
Hyderabad, भारत