Senior Technology Architect in Bengaluru, India - Jobeax
Vacancy description
Senior Technology Architect in Bengaluru, India
Brady Corporation
5600
India, Bengaluru
Senior Technology Architect in Bengaluru, India is listed on Jobeax. Browse 30,000+ vacancies available.
We are a global leader in safety, identification and compliance solutions for a diverse range of workplaces. From the depths of the ocean to outer space, from the factory floor to the delivery room — we’re just about everywhere you look. We have a diverse customer base in industries including electronics, telecommunications, manufacturing, electrical, construction, healthcare, aerospace and more. As of July 31, 2023, Brady employed approximately 5,600 people worldwide. PSS India is an integral corporate arm of Brady Corporation, providing technology, product and business solutions across areas including Product Solutions & Analytics, Advanced Research & Technology, New Product Introduction (NPI), and IT & Business Process Solutions. Lead hardware and Wireless/RF architecture, design, development, validation and release for NPI/NPE products and platform projects.
Own hardware architecture decisions considering product cost, power consumption, form factor, performance, reliability and EMI/EMC compliance.
Translate product requirements and Hardware Requirements Specifications (HRS) into hardware architecture, functional modules and measurable Critical to Quality (CTQ) parameters.
Drive the complete Hardware Development Life Cycle (HDLC) from architecture and design through product validation, release and sustaining engineering.
Work closely with global hardware, firmware/software, mechanical, industrial design, certification, manufacturing and other cross-functional teams.
Design and develop high-quality schematics, review PCB layouts and routing, including 4/6/8/10 layer HDI PCBs and assemblies.
Work closely with PCB fabrication and assembly houses to ensure design manufacturability, quality and production readiness.
Apply DFx (Design for Excellence) practices to optimize cost, yield, manufacturability, assembly, reliability and overall product quality.
Select active and passive components based on product specifications, performance, availability, cost and reliability requirements.
Work with semiconductor vendors and suppliers on technical evaluation, component selection and supplier engagement.
Develop and troubleshoot wireless/RF solutions and contribute to IoT system architecture.
Apply knowledge of wireless technologies such as RFID, WLAN/Wi-Fi and Bluetooth to embedded product development.
Troubleshoot real-world product and field issues related to signal integrity, power consumption, EMI/EMC, ESD and hardware reliability.
Ensure hardware designs comply with applicable industry and regulatory standards including FCC, IC, ETSI, UL,CE, MIL-STD.
Experienced in DFMEA/FMEA and subsystem reliability analysis, DFM/DFT for high-volume production, and factory support during production phases.
Use engineering tools such as Mentor Graphics, Valor and Cadence for design, simulation, analysis and manufacturing-related activities.
Monitor technology trends in hardware architecture, wireless technologies and industry/mobile standards and identify opportunities for innovation.
Work with high-maturity hardware, software, mechanical, industrial user experience and certification teams to deliver production-ready products.
Support multiple embedded hardware products through the complete development lifecycle from concept to production and sustaining engineering.
15+ years of overall experience in embedded hardware architecture, design, development and product engineering.
Minimum 3 years of experience in hardware architecture, design, development and release of industrial products.
Proven experience in the complete development lifecycle of at least 2–3 embedded hardware products.
Strong hands-on experience in embedded hardware architecture and product development.
Strong expertise in schematic design, PCB layout, routing, hardware bring-up and debugging.
Practical experience designing and developing 4-layer/6-layer HDI PCBs and assemblies.
Strong understanding of IoT systems, embedded hardware and wireless technologies.
Strong understanding of product-level cost, power consumption, form factor, EMI/EMC and reliability considerations.
Experience working with semiconductor vendors, component suppliers, PCB fabrication and assembly partners.
Hands-on troubleshooting experience with signal integrity, power integrity/power consumption, EMI/EMC and ESD is preferred.
Experience collaborating with global and cross-functional teams across hardware, software/firmware, mechanical, industrial design, certification and manufacturing.
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