RADWIN | Chennai, India | Full-time
The Role
RADWIN is looking for a hands-on Senior Hardware Engineer to develop next-generation wireless platforms based on Qualcomm networking SoCs, ARM-based processors, and FPGAs.
Reporting to the Platform Group Manager, you will take technical ownership of digital and power hardware development, from architecture and schematic design through board bring-up, validation, and production. You will work closely with RF and antenna, mechanical, software, firmware, compliance, and manufacturing teams.
Responsibilities
- Develop hardware architectures, block diagrams, and detailed designs, taking projects from concept through mass production.
- Design processor-based boards using Qualcomm SoCs and other ARM-based processors, including DDR memory, flash, PCIe, USB, Ethernet/SerDes interfaces, clocking, and reset circuits.
- Design power systems, including multi-rail PMICs, DC/DC converters, power sequencing, PoE (PD/PSE), protection circuits, and power budgets for outdoor products operating across wide temperature ranges.
- Develop FPGA board designs, including device selection, pin planning, configuration, high-speed interfaces, and integration with FPGA and firmware engineers.
- Create and maintain schematics in OrCAD Capture. Guide PCB layout, define stack-up and signal- and power-integrity constraints, and review component placement and routing.
- Perform signal-integrity, power-integrity, and thermal analyses, validating results against lab measurements.
- Bring up and debug complex boards with software and firmware teams using oscilloscopes, logic and protocol analyzers, JTAG, and power analyzers.
- Define and execute hardware design verification tests, including margin, temperature, power, and reliability testing. Support EMC, surge, and safety qualification.
- Work with Qualcomm and other component vendors on reference designs, design reviews, and technical issue resolution.
- Support manufacturing test development, production troubleshooting, component obsolescence, and design improvements.
- Contribute to design reviews, engineering documentation, and design guidelines, and share technical expertise with other engineers.
REQUIREMENTS
Requirements
- BSc in Electrical Engineering.
- At least 10 years of hands-on digital hardware design experience.
- Proven ability to independently own complex hardware designs from architecture through production.
- Experience designing boards based on Qualcomm SoCs, such as IPQ networking platforms, or comparable high-performance processors.
- Strong high-speed digital design experience, including DDR3/4/LPDDR, PCIe, USB 3.x, multi-gigabit Ethernet, and SerDes.
- In-depth experience with DC/DC converters, PMICs, power sequencing, and PoE.
- Hands-on FPGA board design experience using AMD/Xilinx, Intel/Altera, or Lattice devices.
- Proficiency in OrCAD Capture and experience guiding and reviewing PCB layouts in Allegro or equivalent tools.
- Experience with SI/PI simulation tools such as HyperLynx, SIwave, or Sigrity.
- Strong board bring-up and lab debugging skills on complex multilayer boards.
- Experience with EMC, surge, and safety standards, such as EN 55032, IEC 61000-4-x, and IEC 62368-1.
- Strong communication skills and the ability to collaborate across engineering disciplines.
- Excellent written and spoken English.
Advantages
- MSc in Electrical Engineering.
- Experience with telecom, wireless, or outdoor networking equipment.
- Experience with Wi-Fi 6/7 access points or base stations.
- HDL knowledge, including VHDL/Verilog, and experience with FPGA timing closure.
- Experience with timing and synchronization technologies, including SyncE, IEEE 1588, and GNSS.
- Familiarity with railway or industrial standards, including EN 50155 and EN 50121.
- Python scripting for test automation.
- Experience working with contract manufacturers in Asia.
- Experience mentoring engineers or providing technical leadership.