We are looking for a highly skilled SMT professional with strong electronics background to coordinate and manage programs related to AOI, SPI, Pick & Place (P&P), Reflow/Profile, X-ray inspection, and End-of-Line (EOL) rework activities. The role requires deep expertise in SMT processes, machine programming, defect analysis, and cross-functional coordination to ensure high-quality production output.
Key Responsibilities
Program Coordination
Coordinate complete SMT program setup and validation including:
AOI (Automated Optical Inspection)
SPI (Solder Paste Inspection)
Pick & Place machines
Reflow oven profiling
X-ray inspection programs
Ensure smooth program releases from NPI to mass production.
Maintain version control and optimization of machine programs.
Process Engineering & Optimization
Develop, validate, and optimize SMT process parameters.
Perform solder paste, stencil, and component placement optimization.
Define and monitor reflow profiles for different PCB assemblies.
Troubleshoot process issues and improve first-pass yield (FPY).
Inspection & Quality Control
Create and fine-tune AOI & SPI inspection criteria and libraries.
Develop X-ray inspection standards for BGA/QFN and critical components.
Analyze defects such as:
Solder bridges
Insufficient/excess solder
Component misalignment
Voids and hidden defects
EOL Rework Coordination
Coordinate End-of-Line (EOL) rework activities.
Analyze failure modes and root causes.
Guide rework technicians for complex repairs (BGA, fine-pitch, etc.).
Ensure rework quality meets IPC standards.
NPI & Documentation
Support New Product Introduction (NPI) builds.
Prepare and maintain:
Work instructions (WI)
SOPs
Process flow documents
Conduct risk assessments and DFx (Design for Manufacturability).
Cross-functional Coordination
Liaise with production, quality, maintenance, and design teams.
Support customer requirements and audits.
Ensure compliance with IPC, ISO, and customer quality standards.
Requirements
Required Skills & Competencies
Strong knowledge of SMT processes and electronics assembly.
Hands-on experience with:
AOI, SPI, P&P programming
Reflow profiling tools
X-ray inspection systems
Expertise in defect analysis and root cause methodologies (8D, Fishbone, etc.).
Good understanding of PCB design and electronic components.
Familiarity with IPC standards (IPC-A-610, IPC-7711/7721).
Strong analytical and problem-solving skills.
Educational Qualification
Bachelor’s / Diploma in:
Electronics Engineering
Electrical Engineering
Instrumentation or related field
Experience
Minimum 5–10 years of experience in SMT/EMS industry.
Proven experience in program coordination and process engineering.
Preferred Skills
Experience in high-mix, high-volume production environments.
Knowledge of MES systems and Industry 4.0 tools.
Six Sigma / Lean Manufacturing exposure is an advantage.
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